Accessory Compatibility
| Recommended | Not Recommended | |
| Build Plate | Cool Plate, High Temperature Plate or Textured PEI Plate | Engineering Plate |
| Hotend | All Size / Material | / |
| Glue | Bambu Liquid Glue Glue Stick |
/ |
| Recommended Printing Settings | |
| Drying Settings (Blast Drying Oven) | 55 °C,8 h |
| Printing and Keeping Container’s Humidity | < 20% RH (Sealed, with Desiccant) |
| Nozzle Temperature | 190 – 230 °C |
| Bed Temperature (with Glue) | 35 – 45 °C |
| Printing Speed | < 300 mm/s |
| Physical Properties | |
| Density | 1.24 g/cm³ |
| Vicat Softening Temperature | 57 °C |
| Heat Deflection Temperature | 57 °C |
| Melting Temperature | 160 °C |
| Melt Index | 42.4 ± 3.5 g/10 min |
| Mechanical Properties | |
| Tensile Strength | 35 ± 4 MPa |
| Breaking Elongation Rate | 12.2 ± 1.8 % |
| Bending Modulus | 2750 ± 160 MPa |
| Bending Strength | 76 ± 5 MPa |
| Impact Strength | 26.6 ± 2.8 kJ/m² |
Printing Tips
• For better print results, please reduce the Max volumetric speed from 21 mm³/s to 15 mm³/s when printing PLA Basic Silver/Gold/Bronze.
• Drying conditions: 55℃ for 8 hrs. Store in a dry environment after use. Dry before use if the material absorbs moisture. For more details please refer to: Filament drying instructions on WIKI.
















